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Thursday 21 January 2010 in EngineerIT | Tags: BGA/CSP, Christopher Associates, G. Clark, H. Takahashi, head-in-pillow, J. Bath, Koki Solder, lead-free, M. Itoh, N. Uchida, R. Garcia, SnAgCu, solder paste, soldering | by Annette Thompson | Leave a comment
Over the last few years, there has been an increase in the rate of head-in-pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecoms and military. Part I of this article was published in EngineerIT November 2009… (more)
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